Item	Required Characteristics	Test Method / Condition
High Temperature Storage Test Reference Documents: GB/T 2423.2-2008 Method Bb	1.No significant defects in appearance. 2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% ) 3.ΔQ/Q≦30% (Only SMD series) 4.ΔDCR/DCR≦10%	Temperature: N±2℃ (N: Follow the product specification for the setting.) Time : 96±2 hours Place the samples for one hour at room temperature and test them within two hours.
Low Temperature Storage Test Reference Documents: GB/T 2423.1-2008 Method Ab	1.No significant defects in appearance. 2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% ) 3.ΔQ/Q≦30% (Only SMD series) 4.ΔDCR/DCR≦10%	Temperature: M±2℃ (M: Follow the product specification for the setting) Time : 96±2 hours Place the samples for one hour at room temperature and test them within two hours.
Humidity Test Reference Documents: GB/T 2423.3-2016	1.No significant defects in appearance. 2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% ) 3.ΔQ/Q≦30% (SMD series only) 4.ΔDCR/DCR≦10%	Temperature: 40±2℃ , Humidity: 93±3%RH Time : 96±2 hours Place the samples for one hour at room temperature and test them within two hours.
Thermal Shock Test Reference Documents: GB/T 2423.22-2012 Method Na	1.No significant defects in appearance. 2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% ) 3.ΔQ/Q≦30% (SMD series only) 4.ΔDCR/DCR≦10% T: 15Min if weight≦28g M: low temp. setting T: 30Min if 28g≦weight≦136g N: high temp. setting	Start at M℃ for T time, rush to N ℃ for T time as one cycle, go through 20 cycles.
Solderability Test Reference Documents: GB/T 2423.28-2005 Method Ta	Terminals must have 95% minimum solder coverage.	1.Dip the terminals in the flux then in the solder pot at 245±5℃ for 5 seconds. 2.Solder: lead free 3.Flux: rosin flux
Heat endurance of Reflow soldering Reference documents: GJB 360B-2009 Method 210	1.No significant defects in appearance. 2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% ) 3.ΔQ/Q≦30% (SMD series only) 4.ΔDCR/DCR≦10%	1.Refer to the above reflow curve and go through the reflow for twice. 2.The peak temperature : 260+0/-5℃ 3.The reflow test conditions are based on the testing instruments available in 3L
Vibration test Reference documents: GB/T 2423.10-2019	1.No significant defects in appearance. 2.No short and no open.	Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X , Y and Z direction for 2 hours each. (total 6 hours)
Terminal strength(SMT) Reference documents: GB/T 2423.60-2008	1. HPI / SMD(V) / SMB / SMI / SMW series:Applied force:5N Duration: 10sec 2.Other SMT series besides the above series:Applied force:10N Duration: 10sec 3.Solder paste thickness:0.12mm 4.Meet the above requirements without any loose terminal.	Solder the test samples to the PCB through 245 ℃ reflow, apply a standard force on the side of the test samples for 10 seconds.
Terminal strength(DIP) Reference documents: GB/T 2423.60-2008	1.Terminal diameter(d) mm 0.35＜d≤0.50 Applied force:5N Duration: 10sec 2.Terminal diameter(d) mm0.50＜d≤0.80 Applied force:10N Duration: 10sec 3.Terminal diameter(d) mm0.80＜d≤1.25 Applied force:20N Duration: 10sec 4.Terminal diameter(d) mmD＞1.25 Applied force:40N Duration: 10sec 5.Meet the above requirements without any loose terminal.	Pull Force:the force shall be applied gradually to the terminal and then maintained for 10 seconds.
Drop test Reference documents: GB/T 2423.7-2018	1.No case deformation or change in appearance. 2.No short and no open.	Drop the packaged products from 1m high in 1 angle,3 ridges and 6 surfaces, twice in each direction.

Item

Required Characteristics

Test Method / Condition

High Temperature Storage Test

Reference Documents:

GB/T 2423.2-2008 Method Bb

1.No significant defects in appearance.

2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% )

3.ΔQ/Q≦30% (Only SMD series)

4.ΔDCR/DCR≦10%

Temperature: N±2℃ (N: Follow the product specification for the setting.)

Time : 96±2 hours

Place the samples for one hour at room temperature and test them within two hours.

Low Temperature Storage Test

Reference Documents:

GB/T 2423.1-2008 Method Ab

1.No significant defects in appearance.

2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% )

3.ΔQ/Q≦30% (Only SMD series)

4.ΔDCR/DCR≦10%

Temperature: M±2℃ (M: Follow the product specification for the setting)

Time : 96±2 hours

Place the samples for one hour at room temperature and test them within two hours.

Humidity Test

Reference Documents:

GB/T 2423.3-2016

1.No significant defects in appearance.

2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% )

3.ΔQ/Q≦30% (SMD series only)

4.ΔDCR/DCR≦10%

Temperature: 40±2℃ , Humidity: 93±3%RH

Time : 96±2 hours

Place the samples for one hour at room temperature and test them within two hours.

Thermal Shock Test

Reference Documents:

GB/T 2423.22-2012 Method Na

1.No significant defects in appearance.

2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% )

3.ΔQ/Q≦30% (SMD series only)

4.ΔDCR/DCR≦10%

T: 15Min if weight≦28g M: low temp. setting

T: 30Min if 28g≦weight≦136g N: high temp. setting

Start at M℃ for T time, rush to N ℃ for T time as one cycle, go through 20 cycles.

Solderability Test

Reference Documents:

GB/T 2423.28-2005 Method Ta

Terminals must have 95% minimum solder coverage.

1.Dip the terminals in the flux then in the solder pot at 245±5℃ for 5 seconds.

2.Solder: lead free

3.Flux: rosin flux

Heat endurance of Reflow soldering

Reference documents:

GJB 360B-2009 Method 210

1.No significant defects in appearance.

2.ΔL/L≦10% (Mn-Zn: ΔL/L≦30% )

3.ΔQ/Q≦30% (SMD series only)

4.ΔDCR/DCR≦10%

1.Refer to the above reflow curve and go through the reflow for twice.

2.The peak temperature : 260+0/-5℃

3.The reflow test conditions are based on the testing instruments available in 3L

Vibration test

Reference documents:

GB/T 2423.10-2019

1.No significant defects in appearance.

2.No short and no open.

Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X , Y and Z direction for 2 hours each. (total 6 hours)

Terminal strength(SMT)

Reference documents:

GB/T 2423.60-2008

1. HPI / SMD(V) / SMB / SMI / SMW series:Applied force:5N Duration: 10sec

2.Other SMT series besides the above series:Applied force:10N Duration: 10sec

3.Solder paste thickness:0.12mm

4.Meet the above requirements without any loose terminal.

Solder the test samples to the PCB through 245 ℃ reflow, apply a standard force on the side of the test samples for 10 seconds.

Terminal strength(DIP)

Reference documents:

GB/T 2423.60-2008

1.Terminal diameter(d) mm 0.35＜d≤0.50

Applied force:5N Duration: 10sec

2.Terminal diameter(d) mm0.50＜d≤0.80

Applied force:10N Duration: 10sec

3.Terminal diameter(d) mm0.80＜d≤1.25

Applied force:20N Duration: 10sec

4.Terminal diameter(d) mmD＞1.25

Applied force:40N Duration: 10sec

5.Meet the above requirements without any loose terminal.

Pull Force:the force shall be applied gradually to the terminal and then maintained for 10 seconds.

Drop test

Reference documents:

GB/T 2423.7-2018

1.No case deformation or change in appearance.

2.No short and no open.

Drop the packaged products from 1m high in 1 angle,3 ridges and 6 surfaces, twice in each direction.

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